CAD-based programming for high-resolution µAXI with maximised defect coverage
For fully automatic X-ray inspection (AXI) of PCB assemblies with maximum defect coverage, precise image details with micrometer resolution, 360° rotation, oblique views at up to 70°, maximum positioning accuracy of just a few micrometers and reliable repeatability are absolutely essential. However, with conventional, in-line AXIs, inspection depth is typically determined by the throughput of the SMT production line. Therefore, particularly when you have a large variety of small batches, an offline, high-resolution µAXI system that meets the above quality criteria can often be the better choice.
The phoenix|x-ray product line of GE Sensing & Inspection Technologies has released its x|act technology for simple and intuitive CAD-based µAXI with very high image magnification and thus a comparatively low escape rate and pseudo defect rate.
x|act: quick and easy CAD-based programming
To keep programming time to a minimum, x|act imports the CAD data from the PCB and creates a model from this, which facilitates navigation and also enables inspection strategies to be assigned to the individual components to be inspected. Inspection strategies with all the information required for inspection are already contained in the library for many common solder joints. After the inspection strategies have been assigned, the views required and inspection program are generated automatically.
With CAD-based programming, all the programming steps can be performed offline at a separate workstation, meaning that the inspection system is not blocked during programming. It also means that every program can be transferred to every x|act-capable phoenix|x-ray X-ray system. The CAD data can be viewed in the live image as an overlay at any time and from any viewing angle. This always enables quick and precise solder joint mapping even with manual inspection.
µAXI-capable systems
At Productronica, phoenix|x-ray presented its x|act inspection technology on both nanome|x and microme|x x-ray inspection systems. The devices feature an open nanofocus or microfocus x-ray tube as standard with 180 kV maximum tube voltage and 15 or 20 W maximum power, achieving a detail detectability down to 200 nanometer with the nanome|x and 0.5 micrometer with the microme|x. The ultra-high-performance tube voltage and power ensure that even highly radiation-absorbent parts, such as heat sinks on PCBs, can be inspected. The specimen is manipulated using a calibrated, synchronised five-axis CNC machine offering excellent repeatability.
Computed tomography – an additional benefit of the microme|x and nanome|x systems
An additional benefit of offline inspection is that, because the x-ray system is not connected to the production line, it can be used for simple manual inspections or CT-based 3D component analyses without disturbing production. Furthermore, the specimen is rotated through 360º during the process, permitting a three-dimensional image to be generated from the series of 2D radioscopic images, which enables non-disruptive inspection and three-dimensional visualisation of smaller specimens. phoenix nanome|x, which features the latest x|act software, even offers extremely high-resolution nanofocus computed tomography with voxel resolution of just a few micrometers.
Enquiries:
GE Sensing & Inspection Technologies GmbH
phoenix|x-ray
Niels-Bohr-Str. 7
31515 Wunstorf
Tel.: +49 5031 172-0
Fax: +49 5031 172-299
phoenix-info@ge.com
www.phoenix-xray.com
