Hitachi launches ion milling systems E-3500 cross-section and IM-3000 flat ion

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Hitachi High-Technologies


SEM Preparation Equipment Launched By Hitachi: The E-3500 cross-section ion milling system and the IM-3000 flat ion milling system

Hitachi High-Technologies has utilized its extensive expertise in ion-beam milling techniques to introduce two bench-top sample preparation systems for scanning electron microscopy, the E-3500 cross-section ion milling system and the IM-3000 flat ion milling system. Ion beam polishing of cross-sectional samples produces a flat mirror-finish for high quality SEM imaging, X-ray analysis and mapping, and studies of particle crystal orientation (EBSD).

Hitachi E3500 ion millBoth of the new systems utilize a low energy beam of argon ions so that there is no chemical reaction with most materials and no mechanical stress to the sample. Ion-beam milling eliminates deformation, cracks, scratches, grinding flaws and die wear associated with conventional mechanical grinding and polishing methods used to produce cross-sectional samples for the SEM. The technique can be applied to a host of specimen types, including electronic components (chips, PCBs, IC cards, LEDs), metals, polymers, papers, ceramics, glasses, pharmaceuticals and powders.

The E-3500 features a precisely adjustable mask which is placed over the sample to define the cross sectional edge. In medium precision applications this enables site specific cross-sectioning without the expense or complexity of FIB. A vertical argon ion beam sputter-etches the small region of the sample protruding from the mask to gradually produce a smooth, damage and artefact free cross sectional below the mask edge. The width and depth of the cross-sectional surface are determined by the ion current, ion energy and processing time selected.

The IM-3000 features a sample stage that can both rotate and swing with respect to the centre of the argon ion beam. By varying these, and the angle of incidence of the argon ion beam, it is possible to vary the size of the area being sputter-etched and to produce either a large smooth, flat surface suitable for subsequent EBSD analysis, or to produce a milled profile through the sample.

 

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