Volume 24 Issue 5 July 2010

SEM-EDX of Morphology of Electroless Nickel Coatings with Tin and Tungsten
Wei Sha,¹ Nurzairyani H. J. Mohd Zairin¹ and Xiaomin Wu² 1. School of Planning, Architecture and Civil
Engineering, Queen’s University Belfast, UK. 2. Materials Innovation Institute, Delft, The Netherlands.
Electroless plating of binary Ni-P, ternary Ni-Sn-P and Ni-W-P, and quaternary Ni-W-Sn-P alloy coatings was carried out in alkali-citrate baths. After the plating, several kinds of test were carried out to determine the improvement in the characteristics and properties due to the additional elements as well as to study the change in behaviour when heat treatment was applied to these coatings.

David Cooper,¹ Armand Béché,² Martien Den Hertog,² Aurélian Masseboeuf,² Jean-Luc Rouvière,² Pascale Bayle Guillemaud² and Narcisco Gambacorti¹ 1. CEA, LETI, MINATEC, Grenoble, France. 2. CEA, INAC, MINATEC, Grenoble, France.
There is a need in the semiconductor industry for characterisation techniques that can be used to map electronic, magnetic and strain fields with nanometre-scale resolution. Here we show that off-axis electron holography is a transmission electron microscope-based technique that can be used to quantitatively map these fields for a range of different specimens